Abstracts of 100-500 words and speaker biographies should be submitted to PCEA. Papers and presentations must be noncommercial in nature and should focus on technology, techniques or methodologies ...

A step-down PCB is simply a multilayer PCB whose board thickness is reduced (stepped down) in a few places. The step-down is ...

SUNNYVALE, CA – Synopsys has officially completed its acquisition of Ansys, finalizing a deal first announced in January of last year. The move combines Synopsys’ strengths in silicon design and IP ...

SANTA ANA, CA – TTM Technologies has announced the acquisition of a 750,000 sq. ft. facility in Eau Claire, WI, and land rights for a new manufacturing site in Penang, Malaysia.

PEACHTREE CITY, GA – CIRCUITS ASSEMBLY today announced the 2025 New Product Introduction (NPI) Award winners for electronics assembly equipment, materials and software. The 18th annual NPI Awards ...

Saturn PCB Toolkit version 7.12 PCB design freeware calculates current capacity of a PCB trace, via current, differential pairs and much more. Calculates the following: current a via needs to raise ...

How will the pandemic play out in the PCB world? Here we are, nine months into 2020, with little insight as to how the rest of the year will turn out for printed circuit fabricators. When was the last ...

ATLANTA, GA – After a steep projected decline in April, component industry sentiment stabilized in May, according to just-published results from ECIA’s Electronic Component Sales Trend (ECST) survey.

Printed Circuit Design and Fab online MagazineA symmetrical build is one of the keys to minimize board warpage. A stackup’s construction should be balanced to keep board warpage within IPC ...

Why does ENIG or other lossy plated finishes increase insertion loss? Copper is the most common conductor used on printed circuit boards. It has excellent electrical conductivity, but will oxidize and ...

Yole Group forecasts the advanced IC substrate market to reach $31B by 2030, fueled by AI, glass core substrates, and demand for complex high-performance packaging.