Semiconductor Engineering1h
Startup Funding: Q1 2025
AI chips and data center communications see big funding; 75 startups raise $2 billion. The first quarter of 2025 saw six ...
IEN.eu1h
Ethernet Remote I/O Modules
Acromag’s BusWorks® NT series remote I/O modules now offer a REST- ful API (Representational State Transfer Application ...
DIGITIMES4h
GUC announces tape-out of the world's first HBM4 IP on TSMC N3P
Global Unichip Corp. (GUC), the Advanced ASIC Leader, announced today that it has successfully taped out the world's first ...
The Manila Times5h
Ribbon Showcases AI-Enabled Optical Innovation at OFC
Apollo ADM400/800 Switchponders: These advanced optical networking modules deliver the flexibility of any-to-any service ...
Compound Semiconductor21h
Ayar Labs unveils first UCIe optical chiplet
Compound Semiconductor™ is an Angel Business Communications publication.