News

Abstracts of 100-500 words and speaker biographies should be submitted to PCEA. Papers and presentations must be noncommercial in nature and should focus on technology, techniques or methodologies ...
SUNNYVALE, CA – Synopsys has officially completed its acquisition of Ansys, finalizing a deal first announced in January of last year. The move combines Synopsys’ strengths in silicon design and IP ...
A step-down PCB is simply a multilayer PCB whose board thickness is reduced (stepped down) in a few places. The step-down is ...
SANTA ANA, CA – TTM Technologies has announced the acquisition of a 750,000 sq. ft. facility in Eau Claire, WI, and land rights for a new manufacturing site in Penang, Malaysia.
Yole Group forecasts the advanced IC substrate market to reach $31B by 2030, fueled by AI, glass core substrates, and demand for complex high-performance packaging.
Austin, Texas – High Density Packaging User Group (HDP) is pleased to announce that Lincstech Co., Ltd. (Lincstech) has become a member. “Lincstech has been supporting the electronics industry with ...
Global wrist-worn device shipments rose 10.5% year-over-year in Q1 2025, driven by strong demand across key regions, with Huawei, Xiaomi, and Apple leading the market, according to IDC.
AllSpice.io raises $15 million in Series A funding to scale enterprise features and launch its AI Agent, advancing automation and collaboration for electrical engineering teams.
GBM finalizes Lincstech acquisition to boost AI server PCB capabilities, expanding operations in Singapore and Malaysia to support growth in advanced tech sectors.
PCEA moves PCB East 2026 to Worcester’s DCU Center, offering a larger, cost-efficient venue for New England’s leading electronics design and manufacturing event.
PEACHTREE CITY, GA – JUNE 17, 2025 – PRINTED CIRCUIT DESIGN & FAB is conducting its annual salary survey of printed circuit board designers, design engineers and other layout specialists. PCD&F ...